SMT Definition
Surface-mount technology (SMT) is a method in which the components or ICs are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, the main reason is that SMT allows for increased manufacturing automation. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
The Advantages of SMT Technology in PCB Designs.
The important advantage of SMT in manufacturing includes reduced board cost, reduced material handling costs, and a controlled manufacturing process. Routing of traces is reduced, the size of the board is reduced, and number of drilled holes are also reduced
Product Details:
Payment & Shipping Terms:
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Product Name: | PCB Board Assembly | Lead Time: | 4 Weeks |
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Soldermask: | Green | Material: | Shengyi FR4 Standard |
Application: | Temperature Sensor | Brand Name: | Linked Electronics |
Testing Service: | AOI And Function Test | Surface Finish: | HASL Lead Free |
High Light: | smt pcba,smt printed circuit board assembly |
Professional Custom SMT Electronic PCB Board Assembly Ultra Thin PCB 0.2mm Thickness
Linked Electronics is a leading Printed Circuit Board manufacturer and PCB assembly service provider in China, offering one stop PCB solution service.
Our service is geared towards customers' requirements and Linked Electronics considers no job too small and no turnaround too short notice. We pride ourselves on being flexible and creative and have the experience required to get around those tricky assembly issues. We don't see problems, we devise solutions.
For a fast competitive quote email sales@linked-elec.com or call +86 755 2553 8256.
Linked One Stop PCB Service
1. PCB manufacturing
2. Components Souring
3. SMT Stencil
3. PCB Assembly Service( SMT and DIP)
Look forward to your RFQs and hope we can work together.
Lead time of the precision printed circuit board(pcb) and printed circuit board assembly(pcba):
Sample Lead time(days) | Mass production lead time(days) | |
Single sided PCB | 1~3 | 4~7 |
Double sided PCB | 2~5 | 7~10 |
Multilayer PCB | 7~8 | 10~15 |
PCB and Assembly | 8~15 | 15~30 |
Packaging details: Vacuum packing or Anti-static package, Outer: Standard export carton.
Delivery details: 7-15 days
Port: Shen Zhen/Hong Kong
MOQ: 1
Sample availability: Yes
Payment: L/C, D/A, T/T, Western Union, MoneyGram, Paypal
Quality and Policy :
Linked Electronics continually improve our quality, efficiency, service to satisfy thecustomer's requirement.
Quality Specifications:
Quality System:
1. ISO-9001:2018 Quality System Standard
2. Quality Standard: IPC-610-D class 2,
3. Soldering Standard: J-STD-001 class 1,2,3
4. ESD Standard: ESD-MIL-STD-1686
5. Workshop management:5S
6. FAI-first article inspection
7. In process visual inspection
8. AOI inspection
9. Machine calibration and preventative maintenance
10. ERP material and process management ( ERP=enterprise resource planning computer system)
Quality Standards
IPC-A-610D-G
RoHS Management
Product compliant: RoHS
RoHS prohibited substances list :
NO. Name The upper limit(ppm=mg/kg)
1 Pb 0.1%(1000ppm)
2 Hg 0.1%(1000ppm)
3 Cd 0.001%(100ppm)
4 Cr VI+ 0.1%(1000ppm)
5 PBB 0.1%(1000ppm)
6 PBDE 0.1%(1000ppm)
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PCBA Capabilty
Item | Lot Size | ||||
Normal | Special | Remark | |||
PCB(used for SMT)spec | (L*W) | Min | L≥50mm | L<50mm | Includes the Process Edge |
W≥50mm | |||||
Max | L≤460mm | L > 460mm | |||
W≤400mm | W> 400mm | ||||
(Thickness) | Min thickness | 0.5mm | T<0.5mm | ||
Max thickness | 4.5mm | T>4.5mm | |||
SMT components spec. | dimension | Min size | 201 | 1005 | / |
(0.6mm*0.3mm) | (0.3mm*0.2mm) | ||||
Max size | 200mm*125mm | 200mm*125mm<SMD | / | ||
component thickness | T≤6.5mm | 6.5mm<T≤15mm | / | ||
QFP,SOP,SOJ(multipins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | / | |
CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | / | |
Item | Prototype Manufacturer | ||||
Normal | Special | Remark | |||
SMT PCB SPEC | (L*W) | Min size | L≥50mm | L<50mm | Includes the Process Edge |
W≥30mm | |||||
Max size | L≤450mm | L:800-450mm | |||
W≤350mm | W:400-350mm | ||||
(Thickness) | Minimum thickness | 0.8mm | T<0.8mm | ||
Maximum Thickness | 2mm | T>2mm | |||
DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L<50mm | |
W≥30mm | |||||
Max Size | L≤500mm | L≥500mm | |||
W≤300mm | W≥300mm | ||||
(Thickness) | Minimum Thickness | 0.8mm | T<0.8mm | ||
Maximum Thickness | 2mm | T>2mm |
PCBA Packing by Linked Electronics
Contact Person: Mr. Jonathan
Tel: +86 755 2553 8256
Fax: 86-755-61658416