 |
|
HDI PCB Boards By Definition at Linked Electronics
High Density Interconnect. HDI boards, one of the widely used technologies in PCBs especially in
mobile phones, touch-screen devices, laptop computers, digital cameras and 5G network communication industries, are now available at Linked Electronics . HDI Boards contain blind and/or buried vias and often contain microvias of . 006 or less in diameter. They have a higher circuitry density than traditional circuit boards. HDI Electronic PCB can also reduce the weight and overall dimensions of products, as well as to enhance the electrical performance of the electronic device.
Over the last two decades in PCB fabrication period, Linked Electronics has established a good reputation for manufacturing PCBs of the highest quality. Our custom PCB manufacturing capabilities enable you to get the finest quality HDI PCBs at competitive prices without MOQ requirement. We also have an consistant good quality control department to verify the finished product meet your high quality standards.
Product Details:
Payment & Shipping Terms:
|
| Product Name: | HDI PCB Board | Layer Count: | 10 Layer |
|---|---|---|---|
| Surface Finish: | ENIG Rohs | Smallest Holes: | 0.1mm |
| Traces W/S: | 4/5 Mil | Packing: | Vaccum+Carton+Humidity Indicator+desiccant |
| High Light: | hdi printed circuit boards,bga circuit board |
||
2.0mm 10 Layer HDI Electronic Circuit Board High Frequency PCB Plugged Vias
Founded in 1998, Linked Electronics is now one of the leading one stop PCB solution provider in China.
We have great advantage in the fabrication of high mix, high precision, high end and quick turn PCB board, and rigid flex boards.
Following Services Can be Provided by Linked Electronics
1)1-32 layers PCB board
2)HDI Blind&Buried holes multilayers PCB board
3)High frequency special material base PCB board, such as Rogers, Taconic, Arlon, etc.
4)Heavy copper PCB boards, impedance control circuit boards, carbon ink or peelable mask PCB
5)Assembly Processing: SMT, COB, THT
6)Testing Methods: Flying Probe Test, X-ray, ICT and AOI.
High-density interconnect (HDI) printed circuit boards (PCB) plays an very important role in electronics industry. With the development of 5G and IoT, more and more electronics design engineer use HDI PCB, because the advantages are obvious.
1. Longer battery life due to decreased power usage.
2. Electronics products is getting smaller because more componenents could be populated on both sides
of the HDI PCB by Linked Electronics.
3. If BGA and QFP package is used, Linked Electronics advise the designer to use HDI PCB, because it is more reliable in transmission. HDI by Linked Electronics can accommodate more dense QNF and BGA than previous technique.
Product type: 10 Layer HDI PCB
Application: Communication Industry
| CAPABILITY | STANDARD | ADVANCED |
| MinimumLayer Count | 1 | 1 |
| Maximum Layer Count | 12 | 32 |
| Material |
FR-4 (Tg-135C, 145C, 170C), Halogen- free Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003 Polyimide Teflon Black FR-4 Arlon AR-350 CEM-3 Getek Copper Clad Thermal Substrates Hybrid (Rogers and FR4) BT Epoxy Nelco 4013 PTFE Metal Core Materials Aluminum Core |
|
| Board Thickness | 0.020"-0.125" | 0.005"-0.250" |
| Maximum Board Size |
16" x 22" 12" x 21" 22" x 28" |
10" x 16" 16" x 22" 12" x 21" 22" x 28" |
| Copper Thickness | 0.5 oz – 3 oz | 0.25 oz – 12 oz |
| Minimum Trace Width / Spacing | 0.004"/0.004" | 0.003"/0.003" |
| Solder Mask Color | Green, Blue, Black, Red, Yellow, White, Clear, and customized | |
| Silkscreen Color | White, Black, Yellow, Green, Red, Blue and customized | |
| Minimum Hole Size | 0.008" | 0.004" |
| Finished Hole Size Tolerance | +/-0.003" | +/-0.002" |
| PCB Surface Finish |
HASL (vertical & Horizontal), Lead Free HASL, OSP/Entek, ENIG, ENEPIG, HASL + Gold Finger,Immersion Tin(ISn), Immersion Silver(IAg), Carbon Ink, Hard Gold(Flash Gold), Soft Gold |
|
| IPC Class | Class 2 | Class 3 |
| Controlled Impedance Tolerance | +/-10 % | +/-5 % |
| Blind Vias | Yes | Yes |
| Buried Vias | Yes | Yes |
| Aspect Ratio | 8/1 | 15/1 |
| Minimum Core Thickness | 0.004" | 0.002" |
| Carbon Ink | Yes | Yes |
| Peelable Mask | Yes | Yes |
| Solder Sample | Yes | Yes |
| First Article | Yes | Yes |
| ISO 9001: 2008 | Yes | Yes |
| ISO/TS16949: 2009 | Yes | Yes |
| UL 94v0 | Yes | Yes |
Technique for PCB Assembly by Linked Electronics
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
Information Required for RFQ
1).The detailed files(Gerber files,specification and BOM);
2).Clear 3D pictures of PCBA or samples for us;
3).Test Method
Contact Person: Mr. Jonathan
Tel: +86 755 2553 8256
Fax: 86-755-61658416
