PCB, what we normal call as "printed circuit Board", is the basic for all electronics products.
If we classify the PCB by layers, there will be single sided PCB, double sided PCB, and multilayer PCB Board.
Multilayer PCB Instructions by Linked Electronics
Multilayer PCB Board is made up of more than 2 copper layers, and those copper layers are boned by prepeg. Conductor on different layers are connected with vias.
Compared with doubled sided layers, multilayer circuit board is smaller with higher capacity, faster speed, better durability and greater functionality. For BGA and QNF packages, electronic design engineer will use HDI multilayer PCB.
By category in Linked Electronics, there are multilayer FR4 PCB, multilayer Rogers PCB, multilayer rigid flex PCBs, heavy copper multilayer PCB and HDI multilayer PCB board.
Applications of Multilayer PCBs
Mulilayer PCB is used more and more in electronics industries becuse of its unique advantages.
Multilayer PCB boards is much more precise and has better performance than double sided PCBs, which is widely used in industrial, medical and communication industries.
Payment & Shipping Terms:
|Material:||FR4 S1000-2||Layer Count:||8 Layers|
|Copper Weight:||1oz||Soldermask Registration Tolerance:||+/-0.003"|
|Other Service:||SMT And Stencil||Lead Time:||6 Working Days|
multilayer printed circuit board,
rigid pcb board
Multilayer PCB Consumer Circuit Board 1.6mm Thickness Laser Drill Circuit Board
Linked Electronics is a China based PCB manufacturer with full in house manufacturing capabilities, which specialized in high-mix, prototype, low volume and quick turn PCBs.
If you are intererested, let's discuss in detail.
Linked Technical Capability
|Layers||2 - 30 L.|
|Substrate||FR-4,,CTI600,Tg180,,Anti CAF,Halogen-free,Aluminum-substrate,Copper-strate,High frequency,Tg170&HF,Ceramic|
|Max. panel size||630 mm x 1200 mm (Double layer),550 mm x 650 mm (Multilayer)|
|Board thickness||0.2 mm - 6 mm.|
|Copper thickness||4 oz. (inner) to 6 oz. (outer) (Max)|
|Aspect Ratio||13 : 1 (Advanced 14:1)|
|Min. track width||2.5 mils(partial) 3mil|
|Min. track space||2.5mils(partial) 3mil|
Via in PAD,Resin plugging,Depth routing,Half PTH hole,Blind &buried hole,Press-fit,
|Min. S/M dam||3mil|
|Hole plugging diameter||0.3 mm-0.55 mm.|
|Impedance tolerance||+/- 10%|
|Color of S/M||green,white,black,red,orange,yellow,blue,purple|
|Surface treatment||OSP,HAL,HAL LF,ENIG,Hard gold,Imm Ag,Imm Sn,Peelable mask,Carbon ink print,Kapton tape,Selective OSP,Dual HAL&Gold finger,Dual ENIG&Golder finger|
Contact Person: Mr. Jonathan
Tel: +86 755 2553 8256