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Linked Electronics is a one stop PCB solution provider, which includes PCB fabrication, PCB assembly and parts sourcing service. Our technical capabilities can place SMT components as small as 0201, fine-pitch BGA, QFN board. We have earned the good recommendations from our customers through the excellent services we have provided. PCB Assembly is the process that placing components on the printed circuit boards. Linked Electronics
is specializing in PCB assembly prototying with quick turn service.
Features of Assembly Services
1) Linked Electronics' PCB Assembly service is conformed with UL,CE,FCC,Rohs approval.
2) Professional Surface-mounting and Through-hole soldering technology.
3) SMT 1206,0805,0603,0402,0201parts.
4) UV Conformal Coating.
5) Linked Electronics has high standard SMT&solder assembly lines.
6) Nitrogen gas reflow soldering technology.
7) High density interconnected board placement technology capacity is also available with us.
8) Free X-ray test for PCB prototypes
Product Details:
Payment & Shipping Terms:
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| Application: | Communication | Material: | FR4 |
|---|---|---|---|
| Smallest Hole: | 0.15mm | Surface Treatment: | HAL Rohs |
| PTH Tolerance: | PTH: +/-3mil NPTH: +/-2mil | Copper Weight: | 35um |
| High Light: | pcba service,multilayer pcb assembly |
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IOT Lead Free PCB Board Assembly Through Hole Assembly 1 Layer - 30 Layer
Thank you for your interest.
Linked has been in PCB&PCBA manufacturing for more than 10 years, specializing in high-mix, quick turn around, small batches PCB and PCBA projects
Assembly Capability
| Item | Lot Size | ||||
| Normal | Special | Remark | |||
| PCB(used for SMT)spec | (L*W) | Min | L≥50mm | L＜50mm | Includes the Process Edge |
| W≥50mm | |||||
| Max | L≤460mm | L ＞ 460mm | |||
| W≤400mm | W＞ 400mm | ||||
| (Thickness) | Min thickness | 0.5mm | T＜0.5mm | ||
| Max thickness | 4.5mm | T＞4.5mm | |||
| SMT components spec. | dimension | Min size | 201 | 1005 | / |
| (0.6mm*0.3mm) | (0.3mm*0.2mm) | ||||
| Max size | 200mm*125mm | 200mm*125mm＜SMD | / | ||
| component thickness | T≤6.5mm | 6.5mm＜T≤15mm | / | ||
| QFP,SOP,SOJ(multipins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm | / | |
| CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm | / | |
| Item | Prototype Manufacturer | ||||
| Normal | Special | Remark | |||
| SMT PCB SPEC | (L*W) | Min size | L≥50mm | L＜50mm | Includes the Process Edge |
| W≥30mm | |||||
| Max size | L≤450mm | L:800-450mm | |||
| W≤350mm | W:400-350mm | ||||
| (Thickness) | Minimum thickness | 0.8mm | T＜0.8mm | ||
| Maximum Thickness | 2mm | T＞2mm | |||
| DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L＜50mm | |
| W≥30mm | |||||
| Max Size | L≤500mm | L≥500mm | |||
| W≤300mm | W≥300mm | ||||
| (Thickness) | Minimum Thickness | 0.8mm | T＜0.8mm | ||
| Maximum Thickness | 2mm | T＞2mm | |||
Contact Person: Mr. Jonathan
Tel: +86 755 2553 8256
Fax: 86-755-61658416
