In PCB board prototyping fabrication, HASL (Hot Air Leveling) is the most common service treatment in the last decades which is widely used in electronic devices, communication products, laptops, medical products, aerospace, etc
So what is the advantages and disadvantages of HASL board, Linked Electronics, the electronic PCB board manufacture will make a brief introduction about this.
HASL is one process of the PCB board manufacturing, that is the surface finish process. The process consists of immersing circuit boards in a molten pot of a tin/lead alloy and then removing the excess solder by using 'air knives', which blow hot air across the surface of the board. Solder ability will be strong, but due to its’ limitations, the surface will not be even. The solder areas is small, especially for BGA or other fine pitch, the uneven surface treatment will result in short circuits and other problems.
2.Easy to solder
4.Long shelf life
1.Uneven surface, which is not suitable for fine pitch.
2.Solder bridging for doube side SMT PCB board. If there is double side SMT, the PCB board go through the reflow oven once, and there will be solder bridging. The surface might be more uneven, which cause more trouble for solder.
In recent years, more customers choose OSP, ENIG to replace HASL technique. The technology advancement enables factory to use immersion tin or immersion silver. Also because of Rohs or Reach restrictions in PCB board industries, HASL is used much less in the electronic PCB board.
Linked Electronics Co., Limited is a PCB manufacture and PCB SMT service provider specializing in prototypes, small volumes. We have very strict QC systems. Contact our sales team today to discuss about your PCB requirements.
Contact Person: Mr. Jonathan
Tel: +86 755 2553 8256