When design multilayer PCBs, engineering will adopt an appropriate layer structure as per the EMC and PCB board size, that is too say, engineer will decide it will be a 4 layer, 6 layer PCB or 8 layer PCB. Layer stack-up structure is a key factor that will affect Electromagnetic Compatibility of the electronic products.

PCB stack-up is the sequence of copper layers and insulating layers, we normally call as FR4, And a good structure will have many advantages.

1. It will reduce the cost to fab the PCBs. Linked Electronics will follow engineer’s design to fab the PCB boards, but some special stack-up might request more prepregs or cores, thus customer will pay more cost for that.

2. The optimized stack-up for multilayer PCB will increase the EMC of your products.

3.The right PCB stack-up will minimize the board’s vulnerability to external noise, minimize radiation, reduce impedance and crosstalk concerns on high-speed PCB layouts.

Below Linked will show you the default 1.6mm stack-up for 4, 6, 8 layer PCB boards. Your PCB might have impedance control or other stack-up request, we can make them as per your stack-up structure by using more prepregs or different cores.

4 Layer 

Generally, there is only 1 core for 4 Layer PCBs, customers might ask for 2 cores, that is within our capability, but cost will be 12% up.

6 Layer

8 Layer