Linked Electronics Co., Limited

One Stop PCB solution Provider

Sales & Support
Request A Quote - Email
Select Language
About Us
PCB Services
PCB Capabilities
Quality Assurance
Contact Us
Request A Quote
Home SamplesFR4 PCB Board

Multilayer 0.8mm 35um Copper BGA FR4 PCB Board

PCB Certifications
Good quality PCB Assembly Services
Good quality PCB Assembly Services
Customer Reviews
You have been awesome to work with! The products you have provided have been awesome as well! We will for sure doing some ordering in the near future

—— Amy

Linked have shown strong competitive pricing, quality product and on time delivery in the time we have been working together

—— Karissa

I tell my boss everyday how wonderful you are and how quick to responding you are (when you are awake J). We will continue to go through you guys and have no negative feelings towards you or your company. Thanks for always looking out for us and getting our products here as fast and as cheap as possible.

—— Nate

I'm Online Chat Now

FR4 PCB Board

Multilayer 0.8mm 35um Copper BGA FR4 PCB Board

Multilayer 0.8mm 35um Copper BGA FR4 PCB Board
Multilayer 0.8mm 35um Copper BGA FR4 PCB Board Multilayer 0.8mm 35um Copper BGA FR4 PCB Board Multilayer 0.8mm 35um Copper BGA FR4 PCB Board Multilayer 0.8mm 35um Copper BGA FR4 PCB Board Multilayer 0.8mm 35um Copper BGA FR4 PCB Board

Large Image :  Multilayer 0.8mm 35um Copper BGA FR4 PCB Board

Product Details:

Place of Origin: China
Brand Name: Linked Electronics
Certification: UL, TS16949, ISO14001, ISO9001
Model Number: LPCB1460

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: by negotiation
Packaging Details: vacumm package+carton box
Delivery Time: 4 weeks
Payment Terms: T/T, Western Union,Paypal
Supply Ability: 10, 000pcs per month
Detailed Product Description
Product Name: 6 Layer BGA PCB Material: FR4 Shengyi
Copper Weight: 1OZ Or 35um Testing Method: Flying Probe
Min Holes: 0.35mm Shipping: DHL, UPS, TNT, Fedex
Package: Vacuum Package+Box
High Light:

BGA Fr4 Printed Circuit Board


0.8mm Multilayer Circuit Board


Multilayer 0.8mm FR4 BGA PCB Board 35um Copper All Layers ENIG Gold


About us 


Lined Electronics Shenzhen OEM PCB Assembly Manufacturing



Linked Electronics is Electronic PCB & PCBA manufacturer



1.Fast and one-stop service

2.Accept PCB design,clone and OEM/ODM service.


4.Quote within 48 hours for PCBA projects and 2 hours for PCB fabrication projects


Founded back in 1998, Linked Electronics has been doing a great job in PCB and PCBA manufacturing for more than 2 decades now. We have very high capabilties for the production of double sided electronic PCB board, aluminum PCB board, multilayer FR4 PCB board, PCB assembly, SMT and DIP. Our main PCB business is for small and low volume PCB and PCBA production.


Our good service, on time delivery and excellent quality has help us win great reputation among our customers. Contact Linked Electronics today, and we look forward to seeing you. 




Multilayer 0.8mm 35um Copper BGA FR4 PCB Board



PCB Capabilities


Standard IPC Class2/IPC Class3
Available laminate FR-4 High TG material
Halogen free FR-4
FR-1,CEM-1, Aluminum base
  PCB Maximum Layer 64
  Board Thickness 0.2mm to 7mm
  Min. Track Width/Space 2mils/2mils
  Min. Annular Ring 3mils
  Min. finished hole size



  Copper thickness 0.5oz to 20oz
  Impedance control +/-10%
Surface Finishing Lead Solder HASL
  Lead-Free Solder LF HASL
  Immersion Gold/ENIG
  Immersion Silver
  Immersion Tin
  Carbon Priting
  Gold finger
Outline Profiling CNC Routing
  Edge Plating
File Format GERBER





PCB Process


Multilayer 0.8mm 35um Copper BGA FR4 PCB Board






BGA, ball grid array (BGA), is a kind of surface-mount packaging which is used for IC. BGA packages, generally use on the microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package, each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or matrix on the component. The whole bottom surface of the device can be used instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually soldered by automated SMT production line.


The BGA component looks like


The BGA component on a PCB design Looks like the following


BGA under X-ray Test



Cold Solder Joints


Advantages of BGA Packages:


High Interconnection density


Takes less space on PCB Solder balls used along with stencils will self-align and give great ease to soldering technician while soldering BGA ICs


Low Thermal Resistance of BGA IC package due to efficient heat transfer from heat sinks, heat spreaders and good thermal contact using thermal paste to dissipate heat more effectively. Wide space between pads allows easy soldering. The lower signal inductance and impedance is controlled by separate ground and power planes.


Good electrical conductivity due to shorter interconnection between PCB pad and die. No broken or bent pins like any other leaded package like QFN The BGA packages have larger solder pads that makes the BGA package to be easily de-soldered and rework. Reduced thickness of BGA package render it useful in mobile phones. BGA based PCBs are highly cost effective



Contact Details
Linked Electronics Co., Limited

Contact Person: Mr. Jonathan

Tel: +86 755 2553 8256

Fax: 86-755-61658416

Send your inquiry directly to us (0 / 3000)