Multilayer LCD Rigid Flex Printed Circuit Board Assembly 8 Layer HASL Lead Free
Linked Electronics is a PCB manufacturer with full in house manufacturing capabilities in China. We have been in business for more than 2 decades specializing in quick turn, high quality custom PCB fabrication.
We have acheived highest standard of PCB fabrication industry. And our consistent good quality wins customers around the world.
Rigid Flex PCB has both the flex and rigid boards characteristics. And there are some advantages of the rigid flex PCB Boards made by Linked Electronics. The size is smaller, weight is ligher and performance is highly improved. But there are some limitations for the rigid-flex PCBs. The manufacturing process is rather complicated, and rejection rate is much higher than standard FR4 PCBs. And the price of rigid-flex boards is much more expensive than FR4 PCBs.
Linked Electronics Rigid Flex PCBs are used in following products
2. PC and Computer
3. Flat screen TV
4. Printer, Scanner, FAX machine, Copier.
5. Sound Box
6. MP3, MP4
7. CD/ DVD
8. Digital camera
9. Fax machine and copier
12. Tablet PC
Contact Linked Electronics today and let's discuss your PCB request.
Linked Electronics PCB Capabiltiy
||Min. line width
|Max.board size (single&doule sided)
||Min.annular ring width: vias
HAL(with Pb free),
Imm Ni/Au,Imm Sn,
FR-4; high Tg; high CTI;
halogen free; high frequency(rogers,taconic,
polyclad 370 HR);
Plating thickness (Technique:
|Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
line to board edge
|Outline: 0.2mm V-CUT: 0.4mm
Base copper thickness
(Inner and outer layer)
|Min. thickness:1/3 OZ Max.thickness:6OZ
||Min.hole size(board thickness ≥2mm)
|Finished copper thickness
|Min.thickness 1 OZ,
Max.thickness 10 OZ
Max.thickness 6 OZ
Linked Electronics provides one-stop PCB custom services
1. Offering good quality PCB/PCBA to our customer, Linked will do many kinds of testing to ensure quality before shipment
2.Outgoing test to check min PTH Cu thickness, Min surface Cu thickness, ENIG Au data,Ni data, Au layer adhesion testing, soldermask adhesion testing, silkscreen adhesion testing, Thermal stress testing, hardness testing, Twist/Warp record, microsection report and e-test.
3.Thermal Stress Test to avoid any Delamination, Measling and others.
4.Solderability of PTH to avoid any discolor, Wrinkles, Blisters, Measling, Blow-Hole, Soldermask peel off, and soldermask filled in hole-wall incompletely.
Impedance testing, and so on……
Please feel free to contact with us!