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The Definition of PCB Assembly
Electronic PCB assembly is the process of mouting the electronic components with the wirings of printed circuit boards. The traces or conductive pathways engraved in the laminated copper sheets of PCBs are used within a non-conductive substrate in order to form the assembly.
The Cost of PCB Assembly at Linked Electronics
However, most PCB assembly unit costs range between $10 and $50 depending on the number of units produced that you produced at Linked Electronics.
PCB Assembly Process at Linked Electronics
Step 1: Solder Paste Stenciling. The first step of PCB assembly is applying a solder paste onto the PCB board
Step 2: Pick and Place.
Step 3: Reflow Soldering.
Step 4: Inspection and QC.
Step 6: Final Inspection and Functional Test.
Product Details:
Payment & Shipping Terms:
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| Product Name: | Electronic PCB Boards Assembly | Testing Service: | Free E-test Service |
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| Surfade Treatment: | Immersion Tin | MOQ: | 1PCS |
| Packing: | ESD Package+Carton | Soldermask: | Black |
| Silkprint: | White | Lead Time: | 1 Month Or By Further Discussion |
| High Light: | electronic board assembly,electronic pcba |
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Quick Turn Service Electronic PCB Board Assembly Components Sourcing Function Test
Linked Electronics specialize in PCB manufacturing, PCB assembly, and component sourcing services.
We understand that bringing a product to market in a timely and cost effective manner can mean everything in business.
Our quality, experience, service and pricing combine to become your efficient and reliable electronic supplier.
Assembly Capability
| Item | Lot Size | ||||
| Normal | Special | Remark | |||
| PCB(used for SMT)spec | (L*W) | Min | L≥50mm | L＜50mm | Includes the Process Edge |
| W≥50mm | |||||
| Max | L≤460mm | L ＞ 460mm | |||
| W≤400mm | W＞ 400mm | ||||
| (Thickness) | Min thickness | 0.5mm | T＜0.5mm | ||
| Max thickness | 4.5mm | T＞4.5mm | |||
| SMT components spec. | dimension | Min size | 201 | 1005 | / |
| (0.6mm*0.3mm) | (0.3mm*0.2mm) | ||||
| Max size | 200mm*125mm | 200mm*125mm＜SMD | / | ||
| component thickness | T≤6.5mm | 6.5mm＜T≤15mm | / | ||
| QFP,SOP,SOJ(multipins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm | / | |
| CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm | / | |
| Item | Prototype Manufacturer | ||||
| Normal | Special | Remark | |||
| SMT PCB SPEC | (L*W) | Min size | L≥50mm | L＜50mm | Includes the Process Edge |
| W≥30mm | |||||
| Max size | L≤450mm | L:800-450mm | |||
| W≤350mm | W:400-350mm | ||||
| (Thickness) | Minimum thickness | 0.8mm | T＜0.8mm | ||
| Maximum Thickness | 2mm | T＞2mm | |||
| DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L＜50mm | |
| W≥30mm | |||||
| Max Size | L≤500mm | L≥500mm | |||
| W≤300mm | W≥300mm | ||||
| (Thickness) | Minimum Thickness | 0.8mm | T＜0.8mm | ||
| Maximum Thickness | 2mm | T＞2mm |
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1. Clearly establishing customer requirements.
2. Involving personnel and suppliers at all levels in the planning and achievement of product quality and continual improvement.
3. Meeting the quality assurance system requirements of ISO 9001.
4. Monitoring customer reaction and revising the company’s provisions for the management of product quality accordingly.
5. Focusing on continuous improvement and quality targets with the aim of achieving zero defects through establishing,measuring, and reviewing business objectives, agreed within Annual Business Reviews, for effectiveness.
Contact Person: Mr. Jonathan
Tel: +86 755 2553 8256
Fax: 86-755-61658416
