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SMT Definition
Surface-mount technology (SMT) is a method in which the components or ICs are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, the main reason is that SMT allows for increased manufacturing automation. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
The Advantages of SMT Technology in PCB Designs.
The important advantage of SMT in manufacturing includes reduced board cost, reduced material handling costs, and a controlled manufacturing process. Routing of traces is reduced, the size of the board is reduced, and number of drilled holes are also reduced
Product Details:
Payment & Shipping Terms:
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| Product Name: | Prototype PCB Assembly Service OEM / ODM | Packing: | ESD Packing With Carton Box |
|---|---|---|---|
| Surface Finish: | OSP / HASL / ENIG /Immersion Silver | Application: | IOT |
| Soldermask: | Red | Shipping: | UPS, DHL, TNT, Fedex |
| High Light: | surface mount pcb assembly,smt printed circuit board assembly |
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SMT DIP PCB, Circuit Board Assembly, PCB Assembly Fabrication
Welcome to Linked Electronics
Linked Electronics is a high quality electronic manufacturing services (EMS) manufacturer in China,which offers one -stop PCB assembly service from prototypes, low-volume to mid-volume orders.
We do not have MOQ, you can order even 1pcs.
PCB SMT Assembly Service Capability
| Item | Lot Size | ||||
| Normal | Special | Remark | |||
| PCB(used for SMT)spec | (L*W) | Min | L≥50mm | L＜50mm | Includes the Process Edge |
| W≥50mm | |||||
| Max | L≤460mm | L ＞ 460mm | |||
| W≤400mm | W＞ 400mm | ||||
| (Thickness) | Min thickness | 0.5mm | T＜0.5mm | ||
| Max thickness | 4.5mm | T＞4.5mm | |||
| SMT components spec. | dimension | Min size | 201 | 1005 | / |
| (0.6mm*0.3mm) | (0.3mm*0.2mm) | ||||
| Max size | 200mm*125mm | 200mm*125mm＜SMD | / | ||
| component thickness | T≤6.5mm | 6.5mm＜T≤15mm | / | ||
| QFP,SOP,SOJ(multipins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm | / | |
| CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm | / | |
| Item | Prototype Manufacturer | ||||
| Normal | Special | Remark | |||
| SMT PCB SPEC | (L*W) | Min size | L≥50mm | L＜50mm | Includes the Process Edge |
| W≥30mm | |||||
| Max size | L≤450mm | L:800-450mm | |||
| W≤350mm | W:400-350mm | ||||
| (Thickness) | Minimum thickness | 0.8mm | T＜0.8mm | ||
| Maximum Thickness | 2mm | T＞2mm | |||
| DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L＜50mm | |
| W≥30mm | |||||
| Max Size | L≤500mm | L≥500mm | |||
| W≤300mm | W≥300mm | ||||
| (Thickness) | Minimum Thickness | 0.8mm | T＜0.8mm | ||
| Maximum Thickness | 2mm | T＞2mm | |||
Linked Electronics PCB assembly Workshop
Payment, Packing and Shipping Information
Contact Person: Mr. Jonathan
Tel: +86 755 2553 8256
Fax: 86-755-61658416
